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TEIKAWRELD

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TEIKAWELD method uses a thermit reaction in ordr to obtain a molecular level adhesion, which fact is quite different from any kinds of mechanical crimping. A molecular level adhesion gives an excellent electric conductivity at the weld portion as well as robustness against corrosion or looseness. A long-term performance consistency can be achieved by the method. The method does not require any electric power or heat. The method can be operated anywhere only with the powder and the mold. The method should not be restricted only to connect copper to copper or to connect copper to iron. The method has a wide capability to connect various kinds of metals with different shapes by selecting the appropriate mold. The TEIKAWELD powder contains some special ingredients in copper oxide and aluminum mixture. Safe and rapid operation can be obtained by these ingredients.